Alloy 42,Low expansion 42 Alloy Other/Similar Specs,UNS K94100,E FORU

British Specs:，American Specs: ASTM F30 ASTM B 753 AMS 5683 Welding Wire，German Specs: WS 1.3917,DIN 17745 AFNOR NF A54-301

**PRODUCT DATASHEET: ALLOY 42 / LOW EXPANSION 42 ALLOY - OTHER FORMS & SIMILAR SPECIFICATIONS** **UNS K94100 - Comprehensive Product Range** --- ### **1. OVERVIEW** **Alloy 42**, commercially known as **Low Expansion 42 Alloy**, represents a specialized category of **nickel-iron alloys** with precisely controlled **42% nickel content**, delivering a **thermal expansion coefficient** that perfectly matches **borosilicate glass, alumina ceramics, and semiconductor materials**. This datasheet covers specialized forms, modified compositions, and equivalent materials that maintain the essential characteristics of dimensional stability and thermal compatibility. The alloy is registered under the Unified Numbering System as **UNS K94100**. --- ### **2. CHEMICAL COMPOSITION VARIATIONS (Weight %)** | Element | Standard Alloy 42 | Modified Grade 1 | Modified Grade 2 | High-Purity Version | |------------------|-------------------|------------------|------------------|---------------------| | **Nickel (Ni)** | 41.0 – 42.5% | 40.5 – 42.0% | 42.0 – 43.0% | 41.5 – 42.5% | | **Iron (Fe)** | Balance | Balance | Balance | Balance | | **Manganese (Mn)**| 0.50 – 0.80% | 0.30 – 0.60% | 0.80 – 1.20% | ≤ 0.20% | | **Silicon (Si)** | 0.15 – 0.30% | 0.10 – 0.25% | 0.25 – 0.40% | ≤ 0.10% | | **Carbon (C)** | ≤ 0.05% | ≤ 0.03% | ≤ 0.08% | ≤ 0.02% | | **Chromium (Cr)**| ≤ 0.15% | ≤ 0.10% | 0.20 – 0.40% | ≤ 0.05% | | **Copper (Cu)** | ≤ 0.05% | 0.10 – 0.30% | ≤ 0.05% | ≤ 0.02% | | **Aluminum (Al)**| ≤ 0.05% | ≤ 0.03% | ≤ 0.08% | ≤ 0.01% | | **Sulfur (S)** | ≤ 0.015% | ≤ 0.010% | ≤ 0.020% | ≤ 0.005% | | **Phosphorus (P)**| ≤ 0.015% | ≤ 0.010% | ≤ 0.020% | ≤ 0.005% | --- ### **3. PHYSICAL & MECHANICAL PROPERTIES - COMPARATIVE** | Property | Standard Alloy 42 | Modified Grade 1 | Modified Grade 2 | High-Purity Version | |---------------------------------|-------------------|------------------|------------------|---------------------| | **CTE (20–300°C)** | 4.5 – 5.5 × 10⁻⁶/°C | 4.8 – 5.8 × 10⁻⁶/°C | 4.2 – 5.2 × 10⁻⁶/°C | 4.5 – 5.5 × 10⁻⁶/°C | | **Density (g/cm³)** | 8.11 | 8.10 | 8.12 | 8.11 | | **Tensile Strength (MPa)** | 520 – 620 | 480 – 580 | 580 – 680 | 500 – 600 | | **Yield Strength (MPa)** | 280 – 380 | 250 – 350 | 320 – 420 | 260 – 360 | | **Elongation (%)** | 30 – 40 | 35 – 45 | 25 – 35 | 32 – 42 | | **Hardness (HRB)** | 65 – 80 | 60 – 75 | 70 – 85 | 63 – 78 | | **Curie Temperature (°C)** | 360 | 350 | 370 | 360 | --- ### **4. INTERNATIONAL STANDARDS & GLOBAL EQUIVALENTS** | Region/Standard | Primary Equivalent | Alternative Designations | |-------------------|--------------------|--------------------------| | **UNS** | K94100 | - | | **ASTM** | F30 | A658, F2543 | | **EN (Europe)** | 1.3917 (Ni42Fe) | 1.3916, 1.3921 | | **ISO** | NiFe42 | - | | **JIS (Japan)** | C42N | NCF42 | | **GB (China)** | 4J42 | 4J41, 4J43 | | **DIN (Germany)** | Ni42 | - | | **GOST (Russia)** | 42H | 42Н | --- ### **5. SPECIALIZED PRODUCT FORMS** #### **5.1 Wire & Fine Wire Products** - **Diameter Range**: 0.02 mm to 6.0 mm - **Surface Finish**: Bright, coated, or plated - **Temper Conditions**: Annealed, 1/4 hard, 1/2 hard, hard - **Special Types**: Resistance welding wire, electronic lead wire #### **5.2 Powder & MIM Feedstock** - **Particle Size**: 5-45 μm for MIM applications - **Purity Level**: 99.5% minimum - **Binder Systems**: Custom formulations available - **Applications**: Small, complex shaped components #### **5.3 Clad & Composite Materials** - **Copper-Clad Alloy 42**: For enhanced electrical conductivity - **Stainless Steel Clad**: For improved corrosion resistance - **Multi-layer Composites**: Custom layer configurations - **Applications**: Electronic substrates, lead frames #### **5.4 Sputtering Targets** - **Purity**: 99.95% minimum - **Density**: ≥ 95% theoretical density - **Bonding**: Indium or silver epoxy bonded - **Applications**: Thin film deposition, semiconductor processing --- ### **6. MODIFIED & ENHANCED GRADES** #### **6.1 High-Strength Variants** - **Precipitation Hardenable**: With titanium and aluminum additions - **Cold Worked Versions**: Enhanced strength through work hardening - **Micro-alloyed Grades**: With vanadium or niobium for grain refinement #### **6.2 Enhanced Machinability Grades** - **Sulfur-Modified**: Improved chip breaking and tool life - **Selenium-Modified**: Alternative to sulfur-modified versions - **Lead-Free Variants**: Environmentally friendly machining grades #### **6.3 Special Thermal Characteristics** - **Low-CTE Premium**: Tighter CTE control for critical applications - **Wide-Range Matching**: Optimized for broader temperature ranges - **Cryogenic Grades**: Enhanced low-temperature performance --- ### **7. SPECIAL APPLICATIONS & CONFIGURATIONS** #### **7.1 Composite Tooling Applications** - **Aerospace Molds**: Large composite curing tools - **Automotive Dies**: Precision forming and molding dies - **Industrial Tooling**: Jigs, fixtures, and measurement tools #### **7.2 Optical & Precision Instruments** - **Mirror Mounts**: Stable optical mounting systems - **Laser Components**: Precision laser system parts - **Measurement Equipment**: Dimensional measurement fixtures #### **7.3 Semiconductor Manufacturing** - **Wafer Carriers**: Silicon wafer handling components - **Process Chamber Parts**: Semiconductor processing equipment - **Mask Alignment**: Photolithography system components --- ### **8. QUALITY ASSURANCE & CERTIFICATION** #### **8.1 Standard Certifications** - **Material Certificates**: EN 10204 3.1/3.2 - **Quality Systems**: ISO 9001, IATF 16949, AS9100 - **Industry Specific**: NADCAP, PED, RoHS, REACH #### **8.2 Special Testing Capabilities** - **CTE Measurement**: Precision dilatometer testing - **Surface Analysis**: SEM/EDS, surface roughness mapping - **Cleanliness Testing**: Particle count and contamination analysis - **Electrical Testing**: Resistivity and conductivity measurements --- ### **9. TECHNICAL NOTES & CONSIDERATIONS** #### **9.1 Thermal Processing Effects** - **Heat Treatment Impact**: Critical for CTE control - **Cooling Rate Effects**: Influence on final properties - **Aging Characteristics**: Long-term dimensional stability #### **9.2 Fabrication Guidelines** - **Machining Parameters**: Optimized speeds and feeds - **Welding Considerations**: Special procedures for different forms - **Surface Treatment**: Compatibility with various processes #### **9.3 Application-Specific Selection** - **CTE Matching**: Selection based on specific glass/ceramic types - **Strength Requirements**: Grade selection for mechanical demands - **Environmental Factors**: Corrosion resistance and temperature limits --- ### **10. GLOBAL SUPPLY CHAIN SUPPORT** - **Multiple Production Sites**: Worldwide manufacturing facilities - **Local Stocking**: Regional distribution centers - **Technical Support**: Global technical service network - **Custom Logistics**: Tailored delivery and inventory programs --- **Note:** The selection of specific Alloy 42 variants should be based on comprehensive application requirements including thermal, mechanical, and environmental factors. Consultation with our technical team is recommended for optimal material selection and processing guidance for specialized applications.

Packing of Standard Packing: Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 2466 gallon liquid totes Special package is available on request.